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READ 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE) [K.I.N.D.L.E]
Title : 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)
Subtitle: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng
Category: Book
Price: $106.51
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Totalreviews: 0
Binding: Hardcover
Publicationdate: 2018-06-11
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